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Thermal Pads T-177 / T-228

Thermal Pads

Trocad Thermally Conductive Insulators Pads are designed to be clean, grease free and flexible. The combination of a tough carrier material such as fibreglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. T-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. T-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface.

T-177/T-228 Pads are ideally suitable where low thermal resistance and low cost are critical.

Trocad T-Pads are available in various TO outlines, in sheets or can be made to your outline drawing.


Typical PropertiesT 177T 228Test Standard
 Part prefix code T177 T228 
 Thickness (mm) 0.177+0.03 -0.01 0.228 ±0.02 
 Breakdown voltage 50Hz RMS 3500 4500 ASTM D149
 Approx Thermal Resistance 
(to -3 transistor) °C/Watt
 0.45 0.50 ASTM D5470
 Hardness 80 ±5 80 ±5 Shore Micro
 Tear Resistance kN/m 50 50 ASTM D624
 Tensile Strength MPa 16 16 ASTM D412
 Dielectric Constant 1000Hz 2.6 2.6 ASTM D150
 Elongation % 30 30 ASTM D412
 Continuous Use Temp. °C -60 to +180 -60 to +180 
 Colour Grey Grey 

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