| Trocad Thermally Conductive Insulators Pads are designed to be clean, grease free and flexible. The combination of a tough carrier material such as fibreglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. T-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. T-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface.
T-177/T-228 Pads are ideally suitable where low thermal resistance and low cost are critical.
Trocad T-Pads are available in various TO outlines, in sheets or can be made to your outline drawing. |
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Typical Properties | T 177 | T 228 | Test Standard | Part prefix code | T177 | T228 | | Thickness (mm) | 0.177+0.03 -0.01 | 0.228 ±0.02 | | Breakdown voltage 50Hz RMS | 3500 | 4500 | ASTM D149 | Approx Thermal Resistance (to -3 transistor) °C/Watt | 0.45 | 0.50 | ASTM D5470 | Hardness | 80 ±5 | 80 ±5 | Shore Micro | Tear Resistance kN/m | 50 | 50 | ASTM D624 | Tensile Strength MPa | 16 | 16 | ASTM D412 | Dielectric Constant 1000Hz | 2.6 | 2.6 | ASTM D150 | Elongation % | 30 | 30 | ASTM D412 | Continuous Use Temp. °C | -60 to +180 | -60 to +180 | | Colour | Grey | Grey | |
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For more information or to register for free samples please contact us. |
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