Trocad R-322 Heat Sink Compound is primarily used for Thermal coupling of electrical/electronic devices to heat sinks. It is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It maintains a positive heatsink seal that improves heat transfer from the electric/electronic device to the heatsink or chassis, thereby increasing overall efficiency of the device.

This product is also used as a high-voltage corona suppressant, nonflammable coating in connections for fly back transformers and TV sets and in aircraft engines where heat sinking properties are required

Trocad Heatsink Compound is a grease like Silicone material, heavily filled with heat conductive metal oxides. This combination ensures high conductivity, low bleed and high temperature stability. The resulting compound will not dry out, harden or melt, even after long term exposure to temperature upto 392°F ( 200°C ). It maintains a positive heatsink seal that improves heat transfer from the electric/electronic device to the heatsink or chassis, thereby increasing overall efficiency of the device.

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TYPICAL PROPERTIES

Method	Test	Result
	Color	White
ASTM D 217	Consistency Penetration
	Unworked	300
	Worked 60 strokes	275
	Worked 100,000 strokes	245
Fed. Std. 791	Bleed after 24 hr at 392°F (200°C)	0.05 %
Fed. Std. 791	Evaporation after 24 hr at 392°F (200°C)	0.5 %
ASTM D 2265	Drop Point	570 (300) °F (°C)
ASTM D 1475	Specific Gravity at 77°F (25°C)	2.1
CTM 1 0069	Thermal Conductivity K Factor	0.0010 cal/sec-cm-°C
ASTM D 149	Dielectric Strength	210 volts/mil
ASTM D 495	Arc Resistance	165 seconds
ASTM D 150	Dielectric Constant at 100 Hz & 100Khz	5
ASTM D 150	Dissipation Factor at 100 Hz /at 100 kHz	0.01/0.02
ASTM D 1169	Volume Resistivity	2 x 10 ohm-cm
ASTM D 4049	Water Spray Off	1.3%

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