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When 2 flat surfaces come in contact with each other,
such as a transistor package and a heatsink, the average contact
area is only 2%, the remaining area is an air gap. Air is a very
poor thermal conductor and so restricts the flow of heat from the
heat generating component to the heatsink. To get the best performance
from a heatsink and to keep the operating temperature of the component
to a minimum, the air gap must be filled with a thermally conductive
medium.
To keep the thermal resistance to the minimum, Trocad offers you
the conventional Thermal Grease as well as the modern
and convenient Thermal Pad.
A) Thermal Grease
- Heat Sink Compound
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| Trocad
R-322 Heat Sink Compound is primarily used for Thermal
coupling of electrical/electronic devices to heat sinks.
This
product is also used as a high-voltage corona suppressant,
a nonflammable coating in connections for flyback transformers
and TV sets and in aircraft engines where heat sinking
properties are required. |
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B) Thermal Pads
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| "Get
rid of the mess with grease and mica". It actually
works out more economical. Trocad
Thermally Conductive Insulators are a combination of a
tough carrier material such as fiberglass and silicone
rubber, which is conformable. T-Pads minimize the thermal
resistance, electrically isolate the semiconductor from
the heat sink and have sufficient dielectric strength
to withstand high voltage. |
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Many
standard sizes and configurations of thermal interface materials
are available. Standard and custom thermal interface pads available
for purchase separately. Click on the link to Request
a sample of our material.
We
are convenietly located in Mumbai, India and deliver to all our
clients accross the country.
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